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Variable frequency microwave curing of polymer materials in microelectronics packaging applications

By Tim Tilford, Keith I. Sinclair, George Goussetis, Christopher Bailey, Marc P.Y. Desmulliez, Kevin Parrott and Alan J. Sangster

Abstract

The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the syste

Topics: TK, QA75
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Year: 2007
OAI identifier: oai:gala.gre.ac.uk:1117

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