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Computer modelling analysis of the globtop's effects on aluminium wirebond reliability

By Hua Lu, Wei-Sun Loh, Christopher Bailey and C. Mark Johnson

Abstract

In power electronics modules, heavy aluminium wires, i.e. wire diameters greater than 100 microns, are bonded to the active semiconductor devices and conductor metallization to form electric circuits of the power electronic module. Due to the high currents that may flow through these wires, a single connection usually contains several wires and thus, a large number of wires are used in a power electronics module. Under normal operation or test condition, a significant amount of stresses and strains induced in the wire and bonding interfaces, resulting in failure over time. In this paper, computer modelling techniques are used to analyse the effect of globtop design on the reliability of aluminium wirebonds under cyclic thermal-mechanical loading conditions. The results will show the sensitivity of the reliability of the wirebonds to the changes in the geometry and the material properties of the wirebond globtop

Topics: TK, QA
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
OAI identifier: oai:gala.gre.ac.uk:1252
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