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Co-design and multi-physics analysis for power electronic modules

By C. Bailey, H. Lu, T. Tilford, J. Rizvi and C. Yin

Abstract

Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that undertake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods, and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics & multi-disciplinary design for power electronics models

Publisher: IEEE Computer Society
Year: 2009
OAI identifier: oai:gala.gre.ac.uk:4459
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