Skip to main content
Article thumbnail
Location of Repository

RF-MEMS switch module in a 0.25 µm BiCMOS technology

By M. Kaynak, M. Wietstruck, W. Zhang, J. Drews, R. Scholz, D. Knoll, F. Korndörfer, C. Wipf, K. Schulz, M. Elkhouly, K. Kaletta, M.V. Suchodoletz, K. Zoschke, M. Wilke, O. Ehrmann, V. Mühlhaus, G. Liu, T. Purtova, A.C. Ulusoy, H. Schumacher and B. Tillack


A BiCMOS embedded RF-MEMS switch module is demonstrated. The module consists of four main blocks: 1) RF-MEMS switch technology, 2) Switch models for design-kit implementation, 3) High Voltage (HV) generation and digital interface, 4) Flexible packaging. The RF-MEMS switch technology is detailed by focusing on the contact model, especially in the down-state. Electromagnetic (EM) and lumped-element models are demonstrated to integrate into foundry process design kit (PDK). The integrated on-chip HV generation and control circuitries are described. A flexible packaging technique is also introduced to package either standalone switches or circuits with several switches

Year: 2012
DOI identifier: 10.1109/SiRF.2012.6160150
OAI identifier:
Provided by: Fraunhofer-ePrints
Download PDF:
Sorry, we are unable to provide the full text but you may find it at the following location(s):
  • (external link)
  • Suggested articles

    To submit an update or takedown request for this paper, please submit an Update/Correction/Removal Request.