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Laser micromachining and micro hot embossing for highly integrated lab-on-chip systems

By T. Enderlein, M. Baum, J. Nestler, T. Otto, J. Besser, M. Wiemer, B. John, J. Hänel and T. Gessner
Year: 2012
OAI identifier: oai:fraunhofer.de:N-218813
Provided by: Fraunhofer-ePrints
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