Halbleiterstruktur, Verfahren zu deren Herstellung und deren Verwendung

Abstract

The invention relates to a semiconductor structure that consists of a substrate and a semiconductor layer which are materially bonded together via a thermally and/or chemically curable adhesion promoter. The invention further relates to a method for producing such bonded connections. The invention also relates to the use of such semiconductor structures, in particular in solar cells or solar cell modules

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Fraunhofer-ePrints

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oai:fraunhofer.de:N-389407Last time updated on 11/15/2016

This paper was published in Fraunhofer-ePrints.

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