Halbleiterstruktur, Verfahren zu deren Herstellung und deren Verwendung

Abstract

The invention relates to a semiconductor structure that consists of a substrate and a semiconductor layer which are materially bonded together via a thermally and/or chemically curable adhesion promoter. The invention further relates to a method for producing such bonded connections. The invention also relates to the use of such semiconductor structures, in particular in solar cells or solar cell modules