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A Packaging Solution for Optically Testing Wire-Bonded Chips

By A. TOSI, F. STELLARI, F. ZAPPA and P. SONG
Topics: sezele
Publisher: 'Institute of Electrical and Electronics Engineers (IEEE)'
Year: 2008
DOI identifier: 10.1109/TADVP.2008.927823
OAI identifier: oai:re.public.polimi.it:11311/517611
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