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"Extraction of Equivalent High Frequency Models for TSV and RDL Interconnects Embedded in Stacks of the 3D Integration Technology" Naples, Italy.

By L. Fourneaud, T. Lacrevaz, J. Charbonnier, C. Fuchs, A. Farcy, C. Bermond, E. Eid and J. Roullard

Abstract

International audienc

Topics: [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
Publisher: HAL CCSD
Year: 2011
OAI identifier: oai:HAL:hal-01068872v1
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