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Solder Joint Quality based on Heating Factor

By Vladimír Ježek

Abstract

Semester project deals with the theoretical processing of reflow soldering. Describes the process of reflow soldering, description of intermetallic compounds, the influence of heating factor on the reliability and strength of soldered joints.Also deals with the preparation of cross-section, X-ray control, thermal cycling and description of test boards

Topics: mikrovýbrus; thermal cycling.; Reflow soldering; X-ray control; Pájení přetavením; cross-section; teplotní cyklování.; intermetalická sloučenina; heating factor; kontrola rentgenovým zářením; intermetallic compound
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Year: 2015
OAI identifier: oai:invenio.nusl.cz:221309
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