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Laser diode soldering

By Michal Straka

Abstract

This work deals with the laser diode soldering. The theoretical part summarizes general and acquired findings about soldering technology and materials that occur in this process. It also describes factors that affect the reliability of solder joints. It is closely focused to the shaping of the solder joint and structure of intermetallic layer. The practical part of this work is focused on the design of equipment for laser diode soldering and subsequent shaping of the samples. The quality of soldered joint is compared against the quality of joint created using re-flow technology - remelting in in-line smelter. The structure and thickness of the intermetallic layer, the number and shape of the voids in the solder joints are compared

Topics: laserová dioda; temperature profile; pájený spoj; pájení; teplotní profil; voids; intermetallic layer; laser diode; soldering joints; intermetalická vrstva; voidy; soldering; metalografický výbrus; metallographic specimen
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Year: 2012
OAI identifier: oai:invenio.nusl.cz:219491
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