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PCBs Repairs with BGA and FC Packages

By Tomáš Buřival

Abstract

Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization

Topics: BGA; reflow; lead free solder; teplotní profil; ball grid array; thermal profile.; SMT; process window index; Slim Kic 2000; surface mount technology; bezolovnaté pájení; kuličkové vývody; PWI; přetavení horkým vzduchem; povrchová montáž.; procesní okno
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Year: 2009
OAI identifier: oai:invenio.nusl.cz:217906
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