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KINEMATICS MODELING OF MAGNETIC AND ABRASIVE SILICON WAFER POLISHING

By R. V. Fedortsev, N. S. Khomich, A. I. Lougovik, A. E. Korzun and P. V. Kukhto

Abstract

<p>The paper considers possibilities to apply magnetic-abrasive machining method as one of the final operations for polishing flat  surfaces  of  silicon  wafers.  A  mathematical  model has  been  built  that reflects main principles of tool-work-piece interactions. A methodology has been developed that permits to give both qualitative and quantitative evaluation of material removal rate. Optimization of technological parameters for a 3905-model machine tool has been carried out with the help of a special software. It has been proved both in theory and experiments that applying magnetic and abrasive polishing of silicon wafers average value of planeness deviation corresponds to SEMI standards.</p><p> </p

Topics: Technology, T
Publisher: Belarusian National Technical University
Year: 2009
OAI identifier: oai:doaj.org/article:d72dc00ce48b473c9a88dc2106135ee0
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