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Through-Hole Filling in a Cu Plating Bath with FunctionalInsoluble Anodes and Acetic Acid as a Supporting Electrolyte

By Yu-Tien Lin, Mei-Ling Wang, Chia-Fu Hsu, Wei-Ping Dow, Shih-Min Lin and Jian-Jun Yang


Through-hole (TH) filling of a printed circuit board (PCB) was conducted with a copper electroplating solution. Tetranitrobluetetrazolium chloride (TNBT) was used as an inhibitor and acetic acid electrolyte instead of a traditional H2SO4 electrolyte wasused for the copper electroplating. Moreover, functional insoluble anodes (DT) that were activated with iridium-based mixed metaloxides on Ti meshes were used instead of conventional soluble anodes (i.e., P-doped Cu). The TH filling performance of the copperelectroplating solution was significantly enhanced when acetic acid electrolyte and DT anodes were used simultaneously in thecopper electroplating bath

Year: 2014
DOI identifier: 10.1149/2.025312jes
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