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Side-chain phenol-functionalized poly(ether sulfone) and itscontribution to high-performance and flexible epoxy thermosets

By Ching Hsuan Lin, Jui Chun Chen, Chu Ming Huang, Jih Mirn Jehng, Hou Chien Chang, Tzong Yuan Juang and Wen Chiung Su

Abstract

We prepared a side-chain phenol-functionalized poly(ether sulfone) (P1) from a one-pot reaction of a4,40-dihydroxybenzophenone (DHBP)-based poly(ether sulfone), poly(oxy-1,4-phenylenecarbonyl-1,4-phenyleneoxy-1,4-phenylene-sulfonyl-1,4-phenylene (DHBP-PES)), with 9,10-dihydro-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and phenol in the presence of sulphuric acid. The phenollinkages of P1 act as reacting sites for epoxy resins. Subsequently, flexible and light-yellow transparentfilms of epoxy thermosets can be achieved from the curing of P1 with cresol novolac epoxy (CNE) anddiglycidyl ether of bisphenol A (DGEBA). The thermoset based on P1 and CNE (P1/CNE) shows a high Tgvalue (241 C), a low coefficient of thermal expansion (44 ppm/ C), and flame retardancy (VTM-0). Themoderate-to-high molecular weight of P1 is responsible for the characteristics high Tg and flexibility,which are rarely seen in epoxy thermosets based on a low-molecular weight curing agent

Topics: Poly(ether sulfone), Curing agent, Thermosets
Year: 2014
DOI identifier: 10.1016/j.polymer.2013.10.054
OAI identifier: oai:ir.lib.nchu.edu.tw:11455/84833
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