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Side-chain phenol-functionalized poly(ether sulfone) and itscontribution to high-performance and flexible epoxy thermosets

By Ching Hsuan Lin, Jui Chun Chen, Chu Ming Huang, Jih Mirn Jehng, Hou Chien Chang, Tzong Yuan Juang and Wen Chiung Su


We prepared a side-chain phenol-functionalized poly(ether sulfone) (P1) from a one-pot reaction of a4,40-dihydroxybenzophenone (DHBP)-based poly(ether sulfone), poly(oxy-1,4-phenylenecarbonyl-1,4-phenyleneoxy-1,4-phenylene-sulfonyl-1,4-phenylene (DHBP-PES)), with 9,10-dihydro-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and phenol in the presence of sulphuric acid. The phenollinkages of P1 act as reacting sites for epoxy resins. Subsequently, flexible and light-yellow transparentfilms of epoxy thermosets can be achieved from the curing of P1 with cresol novolac epoxy (CNE) anddiglycidyl ether of bisphenol A (DGEBA). The thermoset based on P1 and CNE (P1/CNE) shows a high Tgvalue (241 C), a low coefficient of thermal expansion (44 ppm/ C), and flame retardancy (VTM-0). Themoderate-to-high molecular weight of P1 is responsible for the characteristics high Tg and flexibility,which are rarely seen in epoxy thermosets based on a low-molecular weight curing agent

Topics: Poly(ether sulfone), Curing agent, Thermosets
Year: 2014
DOI identifier: 10.1016/j.polymer.2013.10.054
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