This study focuses on developing advanced epoxy resins with characteristic of low water absorption forhalogen-free copper clad laminates (CCL). To achieve this goal, we prepared a bisphenol (1) with twophosphinate pendants via the nucleophilic addition of 9, 10-dihydro-9-oxa-10-phosphaphenanthrene10-oxide (DOPO) with the 1,4-phenylene diamine-based benzoxazines (P-pd). A series of advancedepoxy resins (2) were prepared based on the advancement reaction of (1) and diglycidyl ether ofbisphenol A (DGEBA). After curing of (2), the properties of the resulting thermosets such as glass transitiontemperature, coefficient of thermal expansion, thermal decomposition temperature, waterabsorption, and flame retardancy were evaluated. The structureeproperty relationship was also discussed.Experimental data show that the resulting epoxy thermosets display moderate-to-high Tg, goodflame retardancy, high modulus, and very low water absorption
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