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Neue Produktionskonzepte fuer die Halbleiterfertigung (Smart Fabrication). Phase 0. Teilprojekt: Qualitaetsmanagement Abschlussbericht

By Erlangen (Germany) Siemens AG, Hamburg (Germany) Philips GmbH, Erfurt (Germany) Thesys Gesellschaft fuer Mikroelektronik, Zentrum Mikroelektronik Dresden GmbH (Germany), Heilbronn (Germany) TEMIC TELEFUNKEN microelectronic GmbH, Sindelfingen (Germany) IBM Deutschland G.m.b.H., Muenchen (Germany) Fraunhofer-Institut fuer Festkoerpertechnologie (IFT), Dortmund (Germany) EL-MOS Elektronik in MOS-Technologie GmbH and Stuttgart (Germany) Bosch (R.) G.m.b.H.

Abstract

Available from TIB Hannover: F95B2346 / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman

Topics: 14D - Equipment reliability, quality control, 13H - Industrial processes, manufacturing processes, 09I - Control systems, control theory, SEMICONDUCTOR PRODUCTION, SMART FABRICATION, MICROELECTRONICS, QUALITY MANAGEMENT, PRODUCTION PLANNING, DRY ETCHING, SILICON WAFERS, RESISTANT WIRE PAINTS, TECHNOLOGY MONITORING
Year: 1995
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Provided by: OpenGrey Repository
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