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Mikrosystem-Modultechnik fuer erhoehte Verlustleistung (MST-feV). Teilprojekt: Entwicklung hochintegrierter Leistungsmodule in AlN und LTCC-Technologie Schlussbericht

By C. Schmaus and Cadolzburg (Germany) Siegert Electronic GmbH

Abstract

Available from TIB Hannover: DtF QN1(67,55) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman

Topics: 09A - Components, 09B - Circuits, MODULES, ALUMINIUM NITRIDES, LTCC TECHNOLOGY, SUBSTRATES, MICROSYSTEMS, MINIATURIZATION, LAYERS
Year: 1998
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Provided by: OpenGrey Repository
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