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Ligand-free copper-catalyzed C−S coupling of aryl iodides and thiols

By E. Sperotto, G.P.M. van Klink, J.G. de Vries and G. van Koten


A protocol for the copper-catalyzed aryl−sulfur bond formation between aryl iodides and thiophenols is reported. The reaction is catalyzed by a low amount (1−2.5 mol %) of readily available and ligand-free copper iodide salt. A variety of diaryl thioethers are synthesized under relatively mild reaction conditions with good chemoselectivity and functional group tolerance

Year: 2008
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