Location of Repository

Fluidic packaging of microengine and microrocket devices for high pressure and high temperature operation

By Y. Peles, V.T. Srikar, T.S. Harrison, A. Mracek and S.M. Spearing

Abstract

The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the fabrication of hermetic seals capable of withstanding temperature in the range 20-600/spl deg/C and pressures in the range 100-300 atm. We describe an approach to such packaging by attaching Kovar metal tubes to a silicon device using glass seal technology. Failure due to fracture of the seals is a significant reliability concern in the baseline process: microscopy revealed a large number of voids in the glass, pre-cracks in the glass and silicon, and poor wetting of the glass to silicon. The effects of various processing and materials parameters on these phenomena were examined. A robust procedure, based on the use of metal-coated silicon substrates, was developed to ensure good wetting. The bending strength of single-tube specimens was determined at several temperatures. The dominant failure mode changed from fracture at room temperature to yielding of the glass and Kovar at 600/spl deg/C. The strength in tension at room temperature was analyzed using Weibull statistics; these results indicate a probability of survival of 0.99 at an operational pressure of 125 atm at room temperature for single tubes and a corresponding probability of 0.9 for a packaged device with 11 joints. The residual stresses were analyzed using the method of finite elements and recommendations for the improvement of packaging reliability are suggested

Topics: T1
Year: 2004
OAI identifier: oai:eprints.soton.ac.uk:22778
Provided by: e-Prints Soton

Suggested articles

Preview

Citations

  1. (1996). A bankable microvalve with a Kovar-glass-silicon-glass structure,”
  2. (1994). Adhesion measurement of Ti thin films on Si substrate using internal stress in overcoatedNifilms,”
  3. (2009). Authorized licensed use limited to:
  4. (1998). Fluidic interconnects for modular assembly of chemical systems,”
  5. (1998). Harrison received the S.B and S.M degrees in aeronautics and astronauticsfromtheMassachusettsInstituteofTechnology(MIT),Cambridge,MA, in
  6. (2001). Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections,”
  7. (1997). Macro power from micro machines,”
  8. (1988). Mechanical Metallurgy.
  9. (2001). Microfabrication of a high pressure bipropellant rocket engine,”
  10. (2001). paper EE6.5. [8] Standard Specification for Iron-Nickel-Cobalt Sealing Alloy,
  11. (2001). Silicon couplers for microfluidic applications,”
  12. (1990). Spearing received the Ph.D. degree from the
  13. (1998). was born in 1977. He received the S.B and S.M. degrees in aeronautics and astronautics from the Massachusetts Institute of Technology (MIT),
  14. (1999). Williams,N.I.Maluf,andG.T.A.Kovacs,“Novelinterconnectiontechnologies for integrated microfluidic systems,”
  15. Yoav Peles received the Ph.D. degree in mechanical engineering from the Technion—Israel Institute of Technology, Haifa, Israel, in 1999. HejoinedtheMassachusettsInstituteofTechnologyGasTurbineLaboratory,

To submit an update or takedown request for this paper, please submit an Update/Correction/Removal Request.