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Viscoelastic properties of solder paste and isotropic conductive adhesives used for flip-chip assembly

By R. Durairaj, S. Mallik, A. Seman, A. Marks and N.N. Ekere

Abstract

The printing of pastes (solder pastes and isotropic conductive adhesives) through very small stencil apertures required for flip-chip pitch sizes is expected to result in increased stencil clogging and incomplete transfer of paste to the printed circuit board pads. There is wide agreement in industry that the paste printing process accounts for the majority of assembly defects, and most defects originate from poor understanding of the effect of printing process parameters on printing performance

Topics: T1, TK
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Year: 2008
OAI identifier: oai:gala.gre.ac.uk:2652
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