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Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display

By Yek Lee, Christopher Bailey, Hua Lu, Steve Riches, Martin Bartholomew and Nigel Tebbit


The performance enhancement of AMLCD's has been hindered with problems encountered during the curing process, such as window framing and de-lamination of the glass and adhesive. A thermo-mechanical analysis using FEA was conducted to help optimise the design of the rugged display and enhance the optical performance

Topics: TK, QA75
Publisher: IEEE
Year: 2006
DOI identifier: 10.1109/estc.2006.280164
OAI identifier:
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