As the size of the device is only one or two orders of magnitude higher than the size of the grains, the structural properties, such as the thermo-elastic quality factor (Q), of micro-electro-mechanical systems (MEMS) made of poly- crystalline materials exhibit a scatter, due to the existing randomness in the grain size, grain orientation, surface roughness. In order to predict the probabilistic behavior of micro-resonators, the authors extend herein a previously developed stochastic 3-scale approach to the case of thermoelastic damping. In this method, stochastic volume elements (SVEs) are defined by considering random grain orientations in a tessellation. For each SVE realization, the mesoscopic apparent elasticity tensor, thermal conductivity tensor, and thermal dilatation tensor can be obtained using thermo-mechanical computational homogenization theory. The extracted mesoscopic apparent properties tensors can then be used to define a spatially correlated mesoscale random field, which is in turn used as input for stochastic finite element simulations. As a result, the probabilistic distribution of the quality factor of micro-resonator can be extracted by considering Monte-Carlo simulations of coarse-meshed micro-resonators, accounting implicitly for the random microstructure of the poly-silicon material
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