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A systematic approach to process selection in MEMS

By D.J. Quinn, S.M. Spearing, M.F. Ashby and N.A. Fleck


A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from an extensive review of the literature, and used to construct Process Attribute charts. The performance requirements of MEMS beams and trenches are translated into the same set of Process Attributes. This allows for a screening of the Process Chains to obtain a list of candidate manufacturing methods. This method is illustrated in a brief design example

Topics: TS
Year: 2006
OAI identifier: oai:eprints.soton.ac.uk:42962
Provided by: e-Prints Soton

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  10. (1992). Biosensors: Microelectrical Devices.
  11. (2001). Bulk and interface properties of lowtemperature silicon nitride films deposited by remote plasma enhanced chemical vapor deposition,”
  12. (1998). Bulk micromachining of silicon,”
  13. (1999). Characterization of a time multiplexed inductively coupled plasma etcher,”
  14. (2000). Comparison of Cl2 and F-based dry etching for high aspect raio Si microstructures etched with an inductively coupled plasma source,”
  15. (1996). Complex optical surfaces formed by replica molding against eleastomeric masters,”
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  17. (1996). Control of etch profile for fabrication of Si microsensors,”
  18. (1996). Controlling sidewall smoothness for micromachined Simirrors and lenses,”
  19. Cornell Nanofabrication Facility: NationalNanofabricationUsersNetwork.ProcessDevelopmentforthe IntegrationofMEMSandRFDevices[Online].Available:http://www.
  20. (2001). Deep etching of silicon carbide for micromachining applications: Etch rates and etch mechanisms,”
  21. (1999). Demonstration of pattern transfer into sub100nm polysilicon line/space features patterned with extreme ultraviolet lithography,”
  22. (1988). Design and calibration of a microfabricated floating-element shear-stress sensor,”
  23. (1998). Dry etching of Si field emitters and high aspect ratio resonators using an inductively coupled plasma source,”
  24. (1997). Dry silicon etching for MEMS,” in
  25. (2003). Effective roughness reduction of f100g and f311g planes in anisotropic etching of f100g silicon in 5%
  26. (1996). Electrostatic micro torsion mirrors for an optical switch matrix,”
  27. (1995). Etch rate and surface roughness of deep narrowU-groovesin(110)-orientedsilicon,”J.Micromech.Microeng.,
  28. Etching of Silicon Obermeier.
  29. (1991). Etching roughness for (100) silicon surfaces in Aqueous
  30. (1993). Fabrication of submicron high-aspect-ratio GaAs actuators,”
  31. (1998). Fabrication of thick Si resonators with a frontside-release etch-diffusion process,”
  32. (2001). Fabrication of ultralow-loss Si/SiO waveguides by roughness reduction,”
  33. (2001). Fabrication of ultrathin p++ silicon microstructures using ion implantation and boron etch-stop,”
  34. (1997). Fabrication of Vertical Facets in AlGaAs Using Chemically-Assisted Ion-Beam Etching Univ. of Ulm, Dept. Optoelectronics,
  35. (2002). Freestanding microheaters in Si with high aspect ratio microstructures,”
  36. High Aspect Ratio Etching Protron Mikrotechnik [Online].
  37. (1998). High-Aspect-Ratio Si vertical micromirror arrays for optical switching,”
  38. (1996). Imprint lithography with 25-nanometer resolution,”
  39. (1995). Imprint of sub-25 nm vias and trenches in polymers,”
  40. (1994). In situ electron cyclotron resonance plasma surface cleaning of silicon,”
  41. (1999). Influence of coil power on the etching characteristics in a high density plasma etcher,”
  42. (1994). Insect-Model based microrobot with elastic hinges,”
  43. (2000). Materials Issues in Microelectromechanical Systems
  44. (1999). Materials Selection in Mechanical Design.
  45. (2003). Materials selection in micromechanical design: An application of the Ashby approach,”
  46. (1993). Metallic microstructures fabricated using photosensitive polyimide electroplating molds,”
  47. MicroElectomechanical Systems Module: Single Crystal Reactive Etching and Metallization (SCREAM) Process
  48. (1985). Micromachining of silicon mechanical structures,”
  49. (2002). Microsystem Design.
  50. (1997). Nano-compact disks with 400 Gbit=in ^ 2 storagedensity fabricated using nanoimprint lithographyand read with proximal probe,”
  51. (1996). Nanoscale replication for scanning probe data storage,”
  52. (1998). Nonphotolithographic fabrication of organic transistors with micron feature sizes,”
  53. (1999). Optical properties of surface micromachined mirrors with etch holes,”
  54. (2002). Optimized oxygen plasma etching of polyimide films for low loss optical waveguides,”
  55. (1997). Photoresist Coating Methods MEMS Exchange,
  56. (1977). Plasma etching in integrated circuit manufacture—A review,”
  57. (1999). Plasma etching of silicon nitride with high selectivity over silicon oxide and silicon in fluorine containing plasmas,”
  58. (1989). PlasmaEtching—An Introduction.
  59. (1997). Quantifying distortions in soft lithography,”
  60. (2001). Recent Progress in Silicon Carbide Semiconductor Electronics Technology NASA Glenn Research Center,
  61. (1996). ReleasedSi microstructures fabricated by deep etching and shallow diffusion,”
  62. (1998). Silicon Micromachining.
  63. (1994). Silicon roughness induced by plasma etching,”
  64. (1998). Soft Lithography. : Angewandte Chemie—International Edition,
  65. (1989). Study of electrochemicaletch-stopforhigh-precisionthicknesscontrolofsiliconmembranes,”
  66. (1998). Surface micromachining for microelectromechanical systems,”
  67. (1988). Surface micromachining for microsensors and microactuators,”
  68. (2002). Surface roughness of silicon carbide etched in a
  69. (1995). Surface topography of phosphorous doped polysilicon,”
  70. (1999). Unconventional methods for fabricating and patterning nanostructures,”
  71. (1999). Whitesides,“Largearea patterning byvacuum-assisted micromolding,”

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