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Flip-Chip joining utilizing gold stud bumps

By Tuomo Jaakola, Jaakko Lenkkeri and Jouko Vähäkangas
Topics: /fi/minedu/virta/publicationtypes/d1, D1 Professional magazine article, /fi/minedu/virta/openaccess/0, 0 Not Open Access
Year: 1998
OAI identifier: oai:cris.vtt.fi:openaire_cris_publications/a9316434-6c33-44a8-abf4-5fb2753ed364
Provided by: VTT Research System
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