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Through-Metal-Wall Power Delivery and Data Transmission for Enclosed Sensors: A Review

By Ding-Xin Yang, Zheng Hu, Hong Zhao, Hai-Feng Hu, Yun-Zhe Sun and Bao-Jian Hou
Publisher: MDPI AG
Year: 2015
DOI identifier: 10.3390/s151229870
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Provided by: MUCC (Crossref)
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