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Neural network approach to modeling hot intrusion process for micromold fabrication

By Pun Pang Shiu, George K. Knopf, Mile Ostojic and Suwas Nikumb
Publisher: 'SPIE-Intl Soc Optical Eng'
Year: 2008
DOI identifier: 10.1117/12.817359
OAI identifier:
Provided by: MUCC (Crossref)
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