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Microembossing of ultrafine grained Al: microstructural analysis and finite element modelling

By Xiao Guang Qiao, Mamadou T. Bah, Jiuwen Zhang, Nong Gao, Zakaria Moktadir, Michael Kraft and Marco J. Starink

Abstract

Ultra fine grained (UFG) Al-1050 processed by equal channel angular pressing (ECAP) and UFG Al-Mg-Cu-Mn processed by high pressure torsion (HPT) were embossed at both room temperature and 300 ?C, with the aim of producing micro-channels. The behaviour of Al alloys during the embossing process was analysed using finite element (FE) modelling. The cold embossing of both Al alloys is characterised by a partial pattern transfer, a large embossing force, channels with oblique sidewalls and a large failure rate of the mould. The hot embossing is characterised by straight channel sidewalls, fully transferred patterns and reduced loads which decrease the failure rate of the mould. Hot embossing of UFG Al-Mg-Cu-Mn produced by HPT shows a potential of fabrication of microelectromechanical system (MEMS) components with micro channels

Topics: TN
Year: 2010
OAI identifier: oai:eprints.soton.ac.uk:163079
Provided by: e-Prints Soton

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