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Accurate characterization of wafer bond toughness with the double cantilever specimen

By Kevin Thomas Turner and S. Mark Spearing

Abstract

The displacement-loaded double cantilever test, also referred to as the "Maszara test" and the "crack opening method" by the wafer bonding community, is a common technique used to evaluate the interface toughness or surface energy of direct wafer bonds. While the specimen is widely used, there has been a persistent question as to the accuracy of the method since the actual specimen geometry differs from the ideal beam geometry assumed in the expression used for data reduction. The effect of conducting the test on whole wafer pairs, in which the arms of cantilevers are wide plates rather than slender beams, is examined in this work using finite element analysis. A model is developed to predict the equilibrium shape of the crack front and to develop a corrected expression for calculating interface toughness from crack length measurements obtained in tests conducted on whole wafer pairs. The finite element model, which is validated through comparison to experiments,. demonstrates that using the traditional beam theory-based expressions for data reduction can lead to errors of up to 25

Topics: QC, TA
Year: 2008
OAI identifier: oai:eprints.soton.ac.uk:178869
Provided by: e-Prints Soton
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