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Thermal Interface Material (TIM) Design Guidance For Flip Chip BGA Package Thermal Performance

By T. D. Yuan, Hsin-yu Pan and Yuan Li

Abstract

Thermal interface materials (TIM) are studied to identify its design criterion in a flip chip PBGA applications at different power dissipation levels. As there are continuous interests in proper selection of TIM material and design, the thermal performance analysis can offer design guidance for packaging engineers. Computational techniques are used with both computational fluid dynamics software and finite element analysis (FEA). The purpose of the paper is to identify key design parameters for TIM in different applications where power level ranges can be confined. Results and design recommendations were given and discussed

Topics: thermal interface material, flip chip, thermal resistance
Year: 2011
OAI identifier: oai:CiteSeerX.psu:10.1.1.192.2336
Provided by: CiteSeerX
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