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Abstract A Process Control Methodology Applied to Sub-micron Gate Lithography

By In Manufacturing Gaas Mmlcs


While many useful tools for pursuing process control exist, little has been written to guide manufacturing organizations in using these tools to realize process control on a facility wide basis; Consequently, many organizations fail to realize significant process improvement despite repeated attempts. To fill this gap, a methodology for guiding process driven manufacturing organizations in instituting process control is proposed. The methodology begins with definition of the customer's expectations and of the manufacturing process used to meet these expectations. The output of a given process or sub-process must reach four progressive levels of control. When the output can be reliably measured, it is considered murable. The second level is reached when this output, viewed in aggregate and over time, is found to be Prediclatde. When the distribution of outputs is centered within the spec limits and a 'sufficient ' fraction of the output lies within the spec limits, the process is considered ACCeD. t u. Finally, when the process, as it is currently operated, is fully documented and operator technique is passed on through training, the process reaches the fourth and final level of control, Recoverable. An application of this methodology to the control of sub-micron gate lithography on a GaAs MMIC process at Hewlett-Packard's Microwave Technology Division is discussed. Finally, the unexpectedly broad organizational implications of developing and instituting this methodology at MWTD over the past two years are briefly described

Year: 2009
OAI identifier: oai:CiteSeerX.psu:
Provided by: CiteSeerX
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