Failure Mechanisms of Grounding Pad of High-speed Train


AbstractThe microstructure and failure mechanisms of grounding pad applied on high-speed train were analyzed by using scanning electron microscopy (SEM) with electron dispersion spectrums analysis (EDS) and X-Ray diffraction (XRD). The results show that the grounding pad of high-speed train was a kind of C/Cu powder metallurgy material, and there was Sn element in it besides C and Cu elements. The surface of the grounding pad was oxidized during the process of friction and new phase of CuO observed. The failure mechanisms of the grounding pad of high-speed train were abrasive wear and surface fatigue

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Last time updated on 6/4/2019

This paper was published in Elsevier - Publisher Connector .

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