10.1016/j.egypro.2011.12.1217

Failure Mechanisms of Grounding Pad of High-speed Train

Abstract

AbstractThe microstructure and failure mechanisms of grounding pad applied on high-speed train were analyzed by using scanning electron microscopy (SEM) with electron dispersion spectrums analysis (EDS) and X-Ray diffraction (XRD). The results show that the grounding pad of high-speed train was a kind of C/Cu powder metallurgy material, and there was Sn element in it besides C and Cu elements. The surface of the grounding pad was oxidized during the process of friction and new phase of CuO observed. The failure mechanisms of the grounding pad of high-speed train were abrasive wear and surface fatigue

Similar works

Full text

thumbnail-image

Elsevier - Publisher Connector

Provided original full text link
Last time updated on 6/4/2019

This paper was published in Elsevier - Publisher Connector .

Having an issue?

Is data on this page outdated, violates copyrights or anything else? Report the problem now and we will take corresponding actions after reviewing your request.