This is the author’s final draft of the paper published as Journal of Electronic Materials, 2010, 39 (8), pp. 1295-1297. The original publication is available at www.springerlink.com, Doi: 10.1007/s11664-010-1184-6.Crystallographically faceted void (CFV) formation in lead-free solder joints has been observed after solidification and during subsequent solid-state aging. Such voids have not previously been reported in the literature. This paper gives a preliminary report on observations of voids which tend to be associated with, and adjacent to, intermetallic compounds in the solder bulk and near-substrate interface region. It has been observed that CFVs are correlated with β-Sn crystallographic orientation and form in a tetragonal shape. Aging promotes CFV clustering and growth
To submit an update or takedown request for this paper, please submit an Update/Correction/Removal Request.