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Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints

By S. Belyakov, Helen V. Atkinson and S. P. A. Gill

Abstract

This is the author’s final draft of the paper published as Journal of Electronic Materials, 2010, 39 (8), pp. 1295-1297. The original publication is available at www.springerlink.com, Doi: 10.1007/s11664-010-1184-6.Crystallographically faceted void (CFV) formation in lead-free solder joints has been observed after solidification and during subsequent solid-state aging. Such voids have not previously been reported in the literature. This paper gives a preliminary report on observations of voids which tend to be associated with, and adjacent to, intermetallic compounds in the solder bulk and near-substrate interface region. It has been observed that CFVs are correlated with β-Sn crystallographic orientation and form in a tetragonal shape. Aging promotes CFV clustering and growth

Topics: Lead-free solder, voiding
Publisher: Springer Verlag
Year: 2010
DOI identifier: 10.1007/s11664-010-1184-6
OAI identifier: oai:lra.le.ac.uk:2381/8823
Journal:

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Citations

  1. (2005). Avoiding Microvoids, Assembly (on-line magazine),
  2. (2005). Effect of Voiding on Lead-Free Reliability,

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