Location of Repository

Transient Behaviour of Semi-Solid Alloy Slurries

By Helen V. Atkinson, T. Y. Liu, P. J. Ward, D. H. Kirkwood and P. Kapranos

Abstract

The author presented this paper as an invited keynote lecture at The 6th International ESAFORM conference on Material Forming, Salerno, Italy, April 28-30, 2003. The paper has also been published in the conference Proceedings.Semisolid metals, used in thixoforming, are thixotropic. The slurry viscosity is shear-rate and time dependent provided the semisolid microstructure consists of solid spheroids surrounded by liquid. Thixoforming takes less than 1 second, during which time the structure of the material breaks down. The transient behaviour of semisolid slurries is thus critical to die filling. For solid fractions less than 50%, this breakdown can be studied by viscometry, using rapid data-collection rates, by imposing rapid increases in shear rate on the slurry. For solid fractions greater than 50%, different techniques, such as rapid compression in the thixoformer itself, must be used. Here such experiments with Sn 15%Pb and with aluminium alloys will be described.This work was carried out as part of EPSRC Grant GR/L/98473

Topics: semisolid alloys, transients, viscosity, thixotropy
Publisher: Nuova Ipsa Editore
Year: 2003
OAI identifier: oai:lra.le.ac.uk:2381/8703

Suggested articles

Preview

Citations

  1. (2000). Numerical Simulation of Semi-Solid Casting of an Automotive Component, In:
  2. Rapid Compression of Aluminium Alloys and its Relationship to Thixoformability. Metall. and Mater. Trans. doi
  3. Rheological Modelling on Semi-Solid Metal Alloys and Simulation of Thixocasting Processes. doi
  4. (2001). Semi-Solid Forming ProcessNumerical Simulation and Experimental
  5. (1996). Steady State and Transient Rheological Behaviour of a Semi-Solid Tin Lead Alloy in Simple Shear Flow, In:
  6. (2000). Thixotropic Property Measurement and Flow Modelling in Semi-Solid Metal Alloy Slurries, In:

To submit an update or takedown request for this paper, please submit an Update/Correction/Removal Request.