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RF MEMS Switch with Wafer Level Package Utilizing Frit Glass Bonding

By M. Fujii, I. Kimura, T. Satoh and K. Imanaka
Publisher: 'Institute of Electrical and Electronics Engineers (IEEE)'
Year: 2007
DOI identifier: 10.1109/euma.2002.339235
OAI identifier:
Provided by: Crossref

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