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Micromachined Millimetre-Wave Passive Components at 38 and 77 GHz

By Yi Wang, M. Ke, M.J. Lancaster, F. Huang and R. Lewis

Abstract

A precision micro-fabrication technique has been developed for millimetre-wave components of air-filled three-dimensional structures, such as rectangular coaxial lines or waveguides. The devices are formed by bonding several layers of micromachining defined slices with a thickness of a few hundred micrometres. The slices are thickphotoresist SU8 defined by photolithography, or silicon with a pattern defined by deep reactive ion etching; both are coated with gold by evaporation. The process is simple, and low-cost, as compared with conventional precision metal machining, but yields mm-wave components with good performance. The components are light weight and truly airfilled with no dielectric support. This paper reviews several of these micromachined mm-wave components at 38 and 77 GHz for communications and radar applications

Topics: TK Electrical engineering. Electronics Nuclear engineering
Year: 2009
OAI identifier: oai:eprints.bham.ac.uk:264

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