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Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques

By X. Chen, C. Shaw, L. Gelman and K. T. V. Grattan


In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed

Topics: TJ, TK
Publisher: 'Elsevier BV'
Year: 2019
DOI identifier: 10.1016/j.measurement.2019.03.026
OAI identifier:
Provided by: City Research Online

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