Article thumbnail

Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

By Azrul Hamzah, Jumril Yunas, Burhanuddin Majlis and Ibrahim Ahmad
Publisher: MDPI AG
Year: 2008
DOI identifier: 10.3390/s8117438
OAI identifier:
Provided by: MUCC (Crossref)
Download PDF:
Sorry, we are unable to provide the full text but you may find it at the following location(s):
  • http://www.mdpi.com/1424-8220/... (external link)
  • Suggested articles


    To submit an update or takedown request for this paper, please submit an Update/Correction/Removal Request.