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Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

By Azrul Hamzah, Jumril Yunas, Burhanuddin Majlis and Ibrahim Ahmad
Publisher: MDPI AG
Year: 2008
DOI identifier: 10.3390/s8117438
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Provided by: MUCC (Crossref)
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