Inkjet printed electronics using copper nanoparticle ink

Abstract

Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200 A degrees C of low temperature in N-2 gas condition. The printed electrodes were made with various widths and thickness. In order to control the thickness of the printed electrode, number of printing was varied. Resistivity of printed electrode was calculated from the cross-sectional area measured by a profilometer and resistance measured by a digital multimeter. Surface morphology of electrode was analyzed using scanning electron microscope (SEM) and atomic force microscope (AFM). From the study, it was found that 10 times printed electrode has the most stable grain structure and low resistivity of 36.7 n Omega m.The authors would like to thank the Air Force Office of Scientific Research for supporting us through a MURI grant FA 9550-06-1-0326 to the University of Washington. Also, the authors are grateful to Dr. Les Lee for his encouragements toward this work. Lastly, the authors appreciate Samsung Electro-Mechanics for providing printed electronics using copper nanoparticles