Article thumbnail

High aspect ratio UV photolithography for electroplated structures

By S. Roth, L. Dellmann, G.-A. Racine and N. F. de Rooij


This paper describes single and two layer processes to realize thick resist moulds (40 and 80 μm) with a good reproducibility. The patterning of a thick AZ 4562 photoresist layer is performed with standard photolithography equipment. Different problems related to thick photoresist patterning (edge bead, resist cracking,...) are discussed and solutions are proposed. Side walls are characterized after nickel electrodeposition and mould dissolution in acetone. Results, process limitations and applications are presented

Publisher: 'IOP Publishing'
Year: 2009
DOI identifier: 10.1088/0960-1317/9/2/001
OAI identifier:
Download PDF:
Sorry, we are unable to provide the full text but you may find it at the following location(s):
  • (external link)
  • Suggested articles

    To submit an update or takedown request for this paper, please submit an Update/Correction/Removal Request.