Micro electromechanical systems (MEMS) are finding uses in an increasing number of diverse applications. Currently the fabrication techniques used to produce such MEMS devices are primarily based on 2-D processing of thin films. The challenges faced by producing more complex structures (e.g. high aspect ratio, spans, and multi-material structures) require the development of new processing techniques. Potential solutions to these challenges based on low temperature processing of functional ceramics, selective chemical patterning, and micro-moulding are presented to show that it is possible to create complex functional ceramic structures which incorporate non-ceramic conducting and support structures. The capabilities of both techniques are compared and the relative advantages of each explored
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