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A process chain for integrating microfluidic interconnection elements by micro- overmoulding of thermoplastic elastomers

By Usama M. Attia and Jeffrey R. Alcock


This paper presents a process chain for in-line integration of microfluidic interconnection elements by a variant of micro-injection moulding (mu IM). A SEBS-based thermoplastic elastomer (TPE) was moulded over polymethylmethacrylate (PMMA) to produce a hybrid microfluidic structure with an aspect ratio of 2. The process chain implemented micro-milling for fabricating micro-structured tool inserts, and mu IM and micro-overmoulding was used for replication. A two-plate mould was used for moulding the substrate, whilst a three-plate mould with a replaceable insert was used for TPE overmoulding. The presented application was an interconnect system for a microfluidic device, which enabled direct fitting of standard tubes into microfluidic substrates. A leakage test showed that the interconnection was leak-proof within a range of flow rates between 0.32 and 0.62 ml min(-1)

Topics: hybrid microstructures technologies replication
Publisher: Institute of Physics Publishing; 1999
Year: 2010
DOI identifier: 10.1088/0960-1317
OAI identifier:
Provided by: Cranfield CERES

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