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[[alternative]]Fabrication of the electrostatic microgripper by thick photoresist process

By [[author]]王服賢, Fu-Hsien [[author]]Wang, 王服賢 and Fu-Hsien Wang

Abstract

[[abstract]]The SU-8 thick photoresist is well known for its mechanical and chemical property and it can be used to easily achieve high aspect ratio microstructures with a traditional UV photolithography. Nowadays, the SU-8 photoresist has been applied to different areas such as serving as the base for LIGA electroforming process of mold, as the mold of hot embossing, and also as the material for microstereolithography, optical waveguides, microchannels or some microstructures. However, little research has been carried on using SU-8 as a material for the main structure of micro-actuator. This research is to combine low-cost SU-8 and ICP-RIE technique to build a unitary electrostatic microgripper. This microgripper is expected to have maximum displacement, fast reflection, and is also easily controlled and can be widely applied. Furthermore, we are also interested in discussing the effect of different material on microgripper’s different performance in the electric and dynamic properties so we also built up all-metal microgripper by using electroforming. We have successfully constructed micro-gripper with ICP-RIE technique and were activated to perform gripping function successfully at 19.2 initial voltage. The maximum displacement (400um) was achieved by applying 100V voltage. However, we are not able to release the structure in the photoresist sacrificial layer releasing technique due to the surface tension of the liquid being used. Moreover, we had successfully constructed a microgripper with all-metal technique but due to the strength of metal structure, it cannot actuate even by applying 190V voltage.

Topics: SU-8厚膜光阻, 釋放技術, 電鑄技術, 靜電式微夾持器, SU-8 thick photoresist, release technique, electroforming technique, electrostatic microgripper, [[classification]]53
Year: 2010
OAI identifier: oai:ir.lib.ntnu.edu.tw:309250000Q/6672
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