Characterization of a diffusion soldering process for micro-technology-based energy and chemical systems manufacturing


Graduation date: 2001Several 316 stainless steel meso-scopic devices were made using a diffusion\ud soldering process. Tensile strength and pressure drop of the devices were\ud measured and metallurgical examinations were made of the joints. Continuous\ud bonds were observed in the sample cross-section specimens. Strengths of the\ud diffusion soldered joints were up to 56% of the strength of the Ag₃Sn joint material\ud reported in the literature due largely to Cu contamination in the electroplated\ud layers. The pressure drop measured across the fluidic channels was as low as\ud 0.76 psi at flow rates as high as 2.08 L/min. Identical samples were made using a\ud diffusion bonding method which produced joint strengths up to 100% of the parent\ud material's tensile strength. Overall, for identical flow rates, pressure drops across\ud the fluidic channels were higher for samples made using a diffusion bonding\ud process compared to diffusion soldering

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